ColorFabb CopperFill vs PLA

Compare ColorFabb CopperFill and PLA filaments side-by-side. See which one is best for your 3D printing project.

Detailed Comparison

Property
ColorFabb CopperFill
PLA
Tier Rating
Tier null
Tier A
Family
Specialty
PLA
Nozzle Temp
210°C
185-235°C
Bed Temp
60°C
50-60°C
Enclosure
not needed
not needed
Cooling
High part cooling usually beneficial
Moisture Sensitivity
low
moderate

Strengths Comparison

ColorFabb CopperFill Strengths

    PLA Strengths

    • Easiest to print, cheap, widely available, fast, good bridges/overhangs, easy support removal
    • Stiff non-composite thermoplastic, good tensile strength

    Considerations

    ColorFabb CopperFill Caveats

      PLA Caveats

      • Creeps under sustained load
      • Poor heat resistance, UV degradation, can shatter on drops
      • Not great for sanding/gluing/painting/touch-ups

      Frequently Asked Questions

      Is ColorFabb CopperFill or PLA better for 3D printing?
      PLA is generally rated higher (Tier A) compared to ColorFabb CopperFill (Tier null). However, the best choice depends on your specific needs: ColorFabb CopperFill is best for various applications, while PLA is best for Easiest to print, cheap, widely available, fast, good bridges/overhangs, easy support removal.
      What are the temperature differences between ColorFabb CopperFill and PLA?
      ColorFabb CopperFill prints at 210°C nozzle / 60°C bed. PLA prints at 185-235°C nozzle / 50-60°C bed.
      Do ColorFabb CopperFill and PLA need an enclosure?
      ColorFabb CopperFill: not needed. PLA: not needed.
      Which is more beginner-friendly: ColorFabb CopperFill or PLA?
      Both ColorFabb CopperFill and PLA are beginner-friendly options.

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